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Contact Person: Grace Liu
Email: media@xmcwh.com
On Sept. 27th, 2021, Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.(therein XMC), a leading NVM supplier launched XNOR™-XM25LU128C, an ultra-small size and low-power SPI NOR Flash product, that applies widely to increasingly smaller IoT and wearable devices.
Recently, Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. (XMC), a leading semiconductor R&D and manufacturing company, has carried out in-depth cooperation in professional fields with Xi'an UnilC Semiconductors Co., Ltd. (Xi'an UnilC). The 3DLink™ technology independently developed by XMC has empowered Xi'an UnilC's stacked embedded DRAM (SeDRAM) platform and accelerated the technological innovation of the industry to achieve major breakthroughs: The stacked embedded DRAM (SeDRAM) technology has reached the world's leading level. Relevant technical papers have been successfully included by IEDM 2020 and CICC 2021, and special reports have also been made in IMW 2021. Based on the new 3D IC technology platform (3DLink™), XMC has brought several customized process solutions into mass production.
On April 19, 2021, Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. (hereinafter referred to as "XMC"), a leading supplier of non-volatile memory, announced that it has signed a strategic cooperation agreement with TP-Link Technologies Co., Ltd. (hereinafter referred to as "TP-LINK") to jointly bring better products and technical solutions to the public in the network communication market.
On March 18, 2021, the "2021 China IC Leaders Summit & China IC Design Awards Ceremony", hosted by ASPENCORE, a world-renowned technology media organization in the field of electronic engineering, was held in Shanghai. The XM25QxxxC series of XMC SPI NOR Flash products, with 50nm Floating Gate process, won the "The Best Memory of the Year" for the 2021 China IC Design Award.
On July 3, 2020, Wuhan Xinxin Semiconductor Manufacturing Co., Ltd. (hereinafter referred to as "XMC"), a leading semiconductor manufacturing company , announced that the biological indicators of COVID-19 characteristic detection chip jointly developed and produced by XMC, Liangzhun (Shanghai) Industrial Co., Ltd. (hereinafter referred to as "Liangzhun (Shanghai)") and Huazhong University of Science and Technology had been successfully verified. The chip can be used for a variety of miniaturized, lightweight, non-invasive and portable detecting instruments in communities and families. Compared with the kits currently in use, these detecting instruments are easier to operate, and their detection results are more accurate and can be obtained more quickly. The project team will proceed with the clinical test research of the COVID-19 live virus.